ITR20004
█Reliability Test Item And Condition
The reliability of products shall be satisfied with items listed below.
Confidence level : 90%
LTPD : 10%
NO. Item
Test Conditions
Test Hours/ Sample Failure
Cycles
Sizes
Judgement
Ac/Re
Criteria
1 Solderability
TEMP. : 230 ℃± 5 ℃
5secs
22pcs
More than 90% of 0/1
lead to be covered
by soldering
2 Temperature Cycle H : +85 ℃
30mins 50Cycles
22pcs
I R ≧ U × 2
0/1
5mins
Ee ≦ L × 0.8
L : -55 ℃
30mins
V F ≧ U ×1. 2
3 Thermal Shock
H :+100 ℃
5mins 50Cycles
22pcs
0/1
10secs
U : Upper
L :-10 ℃
5mins
Specification
4 High Temperature
TEMP. : +100 ℃
1000hrs
22pcs
Limit
0/1
Storage
L : Lower
5 Low Temperature
TEMP. : -55 ℃
1000hrs
22pcs
Specification
0/1
Storage
Limit
6 DC Operating Life I F =20mA Vce=5V
7 High Temperature/ 85 ℃ / 85% R.H
1000hrs
1000hrs
22pcs
22pcs
0/1
0/1
High Humidity
█ Recommended Method of Storage
The following are general recommendations for moisture sensitive level (MSL) 4 storage
and use:
Shelf life in sealed bag: 12 months at < 40 °C and < 90% relative humidity (RH)
After bag is opened, devices that will be subjected to reflow solder or other high temperature
process must
a) Mounted within 72 hours of factory conditions < 30 °C/60%RH, or
b) Stored at <20% RH
Devices require bake, before mounting, if:
Humidity Indicator Card is > 20% when read at 23 ± 5 °C
If baking is required, devices may be baked:
a) 192 hours at 40 ℃ ,and <5% RH(dry air/nitrogen) or
b) 96 hours at 60 ℃ ,and <5% RH for all device containers
c) 24 hours at 125 °C
Everlight Electronics Co., Ltd.
http:\\www.everlight.com
Rev 2
Page: 7 of 8
Device No : DRX-004-106
Prepared date: 2007/8/8
Prepared by: Vic Liao
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